Genesi USA, Inc. Washington, D.C

Latest development from bplan GmbH for Genesi USA Inc. Washington, D.C is a  Freescale i.MX53 SoC design. 

Technical specifications of the here shown i.MX53 project are : 

• Dimension 50mm * 100mm 
• Cost optimized 4 layer design 
• Freescale i.MX53 ARM Cortex A8 CPU @ 1GHz 
• Dialog Semiconductor DA9053 PMIC 
• 4GB NAND ( 32 Gb * 8 MLC ) 
• 512MB RAM ( 2* 2Gb DDR3 SDRAM @ 800MHz ) 
• ARM 32-bit Cortex M3 CPU to control miscellaneous I/O functions 
• FPC connector 24 pin 1mm pitch with customized pinning 
• Cirrus Logic CS42L52 24-bit low-power stereo audio codec, with class D speaker amplifier 
• Sagrad W-LAN SG901-1098 IEEE 802.11 B/G/N 
• USB 2.0 connectors 
• LVDS LCD connector and YUV CMOS sensor 
• PS/2 touch interface 
• SD Card connector 
• Mini jack 3,5mm stereo audio connector 
• Battery connector 
• Standard PSU connector12 volt DC 

The design is optimized in all areas. Like height, BOM cost, production cost and battery lifetime. Possible operating systems are Linux and Android. Powered with a 4000mA battery while playing HD content with a 1080p resolution did end up with a battery lifetime of more then 10 hours.