Genesi USA, Inc. Washington, D.C

Latest development from bplan GmbH for Genesi USA Inc. Washington, D.C is a  Freescale i.MX53 SoC design. 

Technical specifications of the here shown i.MX53 project are : 

  • Dimension 50mm * 100mm 
  • Cost optimized 4 layer design 
  • Freescale i.MX53 ARM Cortex A8 CPU @ 1GHz 
  • Dialog Semiconductor DA9053 PMIC 
  • 4GB NAND ( 32 Gb * 8 MLC ) 
  • 512MB RAM ( 2* 2Gb DDR3 SDRAM @ 800MHz ) 
  • ARM 32-bit Cortex M3 CPU to control miscellaneous I/O functions 
  • FPC connector 24 pin 1mm pitch with customized pinning 
  • Cirrus Logic CS42L52 24-bit low-power stereo audio codec, with class D speaker amplifier 
  • Sagrad W-LAN SG901-1098 IEEE 802.11 B/G/N 
  • USB 2.0 connectors 
  • LVDS LCD connector and YUV CMOS sensor 
  • PS/2 touch interface 
  • SD Card connector 
  • Mini jack 3,5mm stereo audio connector 
  • Battery connector 
  • Standard PSU connector12 volt DC 

The design is optimized in all areas. Like height, BOM cost, production cost and battery lifetime. Possible operating systems are Linux and Android. Powered with a 4000mA battery while playing HD content with a 1080p resolution did end up with a battery lifetime of more then 10 hours.